Simple crack propagation model of pressure-sensitive adhesives

Shinobu Sekine and Toshihiro Kawakatsu

Abstract

We propose a simple mechanical model describing viscoelasticity, cavitation growth and crack propagation during the debonding process in pressure-sensitive adhesives (PSAs). Typical materials of PSA are made of block copolymers and they are usually very soft and highly dissipative, and can stick on a variety of surfaces under low pressure in short time. The debonding process of PSA is governed by very complicated dynamics, for example, deformation of the adhesive layer, cavity expansion and coalescence. Our model is a modified version of that proposed by Yamaguchi et al (2006 Eur. Phys. J. E 20 7). We extended his simple model to be applicable to the final rupture process and applied the model to some cases, where we studied the effects of the change of PSA layer's thickness, separation speed and friction coefficient. Our results are qualitatively in good agreement with the experimental data